Back channel etch chemistry of advanced a-Si:H TFTs

نویسندگان

  • A. Kuo
  • T. K. Won
  • J. Kanicki
چکیده

0167-9317/$ see front matter 2010 Elsevier B.V. A doi:10.1016/j.mee.2010.08.001 ⇑ Corresponding author. E-mail address: [email protected] (J. Kanick We report on the effects of back channel etch depth and etchant chemistry on the electrical characteristics of inverted staggered advanced amorphous silicon thin-film transistors. We found that the optimum amorphous silicon film thickness in the channel is about 800–1100 Å. Three dry etch, HBr + Cl2, C2F6, and CCl2F2 + O2, and one wet etch, KOH, chemistries are used for the back channel etch processing. We established that dry etch can be used for the back channel etch of amorphous silicon transistor without degrading its electrical characteristics. 2010 Elsevier B.V. All rights reserved.

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تاریخ انتشار 2010